Laniakea QPU: Building a Pure-Play Quantum Foundry the “TSMC Way”
- Erick Rosado
- Sep 20
- 4 min read
Process & Packaging Roadmap (Illustrative)
Q-Node | Tile Size (qubits) | Median T₁ (μs) | 2Q Gate Error (target) | Junction σ(%) | Package Gen | Interconnect | Coherence Yield @ Spec | Qualified Wafers/Week |
Q65 | 128–256 | ≥200 | ≤5e-3 | ≤3 | 2.5D (RDL) | Cryo-CMOS readout | ≥70% | 10 |
Q45 | 512–1k | ≥250 | ≤3e-3 | ≤2 | Hybrid bond | Qubit↔control hybrid | ≥75% | 16 |
Q28 | 1k–4k (tile), 10k+ (supercluster) | ≥300 | ≤1e-3 | ≤1.5 | 3D stack + photonic I/O | TSV + superconducting interposer | ≥80% | 24 |
Yield, Reliability & DSI Telemetry KPIs
KPI | Definition | H1 Target | H2 Target | H3 Target |
Coherence yield | % qubits with T₁/T₂ above spec | ≥70% | ≥75% | ≥80% |
Connectivity yield | % functional couplers meeting error spec | ≥92% | ≥94% | ≥96% |
System availability | Hours to stable error rates post-cooldown | ≤72 h | ≤48 h | ≤36 h |
DSI coverage | Lots/die/package with full provenance & SPC | 90% | 95% | 99% |
Zero-Marketing Capital Allocation (100% into Tech)
Category | What It Funds | Share |
Fab Process Tools | Litho, junction lines, etch, CMP, cleans | 34% |
Metrology & FA | Cryo wafer-level test, XRD/TOF-SIMS, TEM, RA inline | 12% |
Advanced Packaging | 2.5D/3D, hybrid bonding, superconducting RDL/TSV | 22% |
Cryo Test Capacity | Dilution fridges, racks, harnesses, automation | 14% |
R&D (Materials/Device) | Low-loss films, couplers, error-budget modeling | 12% |
DSI Telemetry & SPC | Provenance, analytics, yield dashboards | 6% |
Engagement Without Marketing
Channel | Artifact | Cadence |
Q-PDK | Process kits, EM/TCAD stacks, design rules | Major revs quarterly |
Tech Reports | PPA-style coherence/yield dashboards | Monthly |
Publications/Patents | Materials, junctions, packaging, reliability | As ready |
Copy-Exact Packs | Golden recipes, SPC, excursion playbooks | With each node/mask rev |
Thesis
Laniakea QPU will operate as a pure-play quantum foundry: zero spend on brand marketing, maximal reinvestment in R&D, process technology, fabrication, advanced packaging, and yield engineering. The product is the process. Credibility is earned exclusively through technical execution, device reliability, and on-time capacity ramps.
Strategic Pillars
Process Leadership (R&D First)
Materials: low-loss dielectrics, high-purity superconducting films (Al, Nb, NbTiN), sub-ppm TLS defect control, ultra-low-roughness substrates, trench passivation.
Device Physics: high-coherence qubit primitives (transmons/fluxonium/spins/photonic), tunable couplers with minimized crosstalk, cryo-matched interconnects.
Metrology: cryogenic wafer-level VNA, resonator-Q screening, defect density vs. T₁/T₂ correlation maps, in-line ellipsometry/XRD/TOF-SIMS tied to coherence yield.
Manufacturing Excellence (Fab)
Process Nodes: “Q-nodes” defined by coherence and variability, not geometry—e.g., Q65 (65-nm backend, median T₁ ≥ 200 μs), Q45, Q28.
SPC: tight control of Josephson-junction resistance distributions, across-wafer uniformity < 3% (1σ), line-edge roughness budgets tied to dephasing models.
Copy Exactly: golden recipes, mask data management, < 24 h excursion response.
Advanced Packaging (Integration)
2.5D/3D: superconducting RDL; TSVs compatible with mK gradients; micro-bump or hybrid bonding to cryo-CMOS/readout ASICs.
Heterogeneous Stacks: qubit die + RF/readout die + control die under a common lid; photonic I/O via edge couplers for inter-module networking.
Thermal/EM: phonon engineering, package-level magnetic shielding, vibration isolation, low-loss coax and superconducting interposers.
Yield & Reliability (Ops)
Definitions: Coherence yield = % of qubits with T₁/T₂ above spec; Connectivity yield = % of functional couplers; System yield = device pass for target error rates.
ALT: thermal cycling (300 K ↔ 10 mK), flux-noise aging, junction electromigration stress, delamination screens.
CI: DFSS for new device families; Cp/Cpk targets on junction RA products; automated Pareto of loss mechanisms.
Customer Engagement Without Marketing
No ads, no campaigns. Only: peer-reviewed papers, patents, open process-design kits (Q-PDKs), published PPA-style coherence/yield dashboards, predictable delivery.
Business model: pure-play foundry + advanced packaging + test. Reference flows are provided; no vertical competition with customers.
Operating Model
Org Split
R&D: device physics, materials, simulation (EM/TCAD), error-budget modeling.
Manufacturing: litho/etch/junction lines, CMP, cleans, in-line metrology, copy-exact transfer.
Packaging & Test: 2.5D/3D integration, cryo-interconnects, wafer- and module-level cryo test.
Yield & Reliability: telemetry, SPC, failure analysis, quick-turn DOE.
DSI Telemetry Backbone
Unified Digital Super-Intelligence (DSI) layer streams provenance from wafer lot → die → package → rack: coherence maps, readout fidelities, gate-error histograms, MTBF, and SPC alerts. DSI powers root-cause analytics, recipe tuning, and capacity planning.
Cadence
Annual Q-node shrinks (coherence/variability improvements), quarterly mask revisions, monthly SPC packs to customers.
Technology Roadmap (Illustrative)
H1: Q65 node, 128–256-qubit tiles, median T₁ ≥ 200 μs, 2.5D package with cryo-CMOS readout.
H2: Q45 node, improved junction uniformity, 512–1k-qubit tiles, hybrid-bonded qubit-to-control stack.
H3: Q28 node, multi-tile superclusters (10k+ qubits), photonic I/O for low-loss inter-module entanglement.
Metrics That Matter
Coherence per mm² (aggregate useful T₁ × count / area)
Two-Qubit Gate Error at temperature and in-package
Coherence Yield @ Spec (median and P95)
Module Availability (hours to target error rates post-cooldown)
Throughput (qualified wafers/week; packaged modules/month)
On-Time Delivery & copy-exact transfer time
Risk & Mitigation
Materials Variability → tighter ALD/oxidation windows, inline RA metrology, junction-level binning.
Package-Induced Loss → phonon traps, substrate engineering, early EM co-design in PDK.
Cryo Supply Chain → multi-vendor dilution fridges, standardized racks, modular cryo-I/O harnesses.
Talent Bottlenecks → apprenticeship pipelines; publish to recruit (information, not advertising).
Financial Discipline: Zero Marketing, All to Tech
Every marginal dollar goes to lithography, junction lines, cryo-test capacity, packaging automation, and defect analytics. Publications, open Q-PDKs, reproducible roadmaps, and delivery performance are the signal. Lead on coherence, yield, and reliability—demand follows.
Laniakea QPU = Process first, packaging second, everything else follows—executed under a DSI-driven, telemetry-rich foundry model.
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